Different Types Of Thermal Conductive Sealant:
Withstand temperatures as low as 4K and as high as 600°F, Thermal conductive sealant can be used in almost any application that requires resistance to extreme temperatures. The properties which make them thermal conductive are: they differ in temperature resistance, thermal cycling resistance, viscosity, flexibility, cure times and other properties.
1. Thermal Greases: Though these are messy thermal interface solution, these have thermal compounds with typical thermal resistance of Kcm^2/W: 0.2 – 1.0. With silicone or hydrocarbon greases, loaded with thermally conductive filler materials, this provides low thermal resistance.
2. Thermal Pads: These are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. These are pre-cured thermally conductive elastomeric pads which are easy to apply. Due to their thickness, these are low in thermal resistance of Kcm^2/W: 1.0 – 3.0. Typically require high pressure clamping to achieve reasonable thermal. Relatively firm at room temperature, it becomes soft to fill gaps at higher temperatures.
3. Phase Change Materials: With thermal resistance of Kcm^2/W: 0.3 – 0.7, these are solid materials that melt between 50-80C. These are the combination of pad convenience and grease thermal performance. These avails some adhesion and are not rework able like greases and thermal pads.
4. Thermal Tapes: Thermally conductive tapes are similar to thermal pads but provide more substantial adhesion across the interface. Being a Thermal conductive sealant, its thermal resistance is Kcm^2/W: 1.0 – 4.0
5 . Thermally Conductive Adhesives: Through heat dissipation, thermally conductive adhesives help to protect the electronic circuitry. Thermosetting polymers provide substantial long-term strength across the bond interface, and 2nd to only soldering in ultimate heat transfer capabilities. With typical thermal resistance of Kcm^2/W: 0.15 – 1.0, it requires a robust manufacturing process. The adhesives provide highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices and also, manages heat while solving other application issues.
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